Sputtering machine Alcatel
Description
Alcatel Sputtering machine
DC/HF with RF bias
HF-Sputter etcher
4x Cathodes
4x 4" Wafers
Materials: Al, Cr, Cu, Ni, AlSi, SiO2
Deposition rate: 100 - 1000 nm/min
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Alcatel Sputtering machine
DC/HF with RF bias
HF-Sputter etcher
4x Cathodes
4x 4" Wafers
Materials: Al, Cr, Cu, Ni, AlSi, SiO2
Deposition rate: 100 - 1000 nm/min